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Payment Terms : T/T
Layer : 4L
Material : FR-4
Board Thickness : 2.0mm
Min. Component Size : 01005
Min. Line Width/Spacing : 0.1mm
Pin Space : 0.2mm
Assembly Method : SMT
Application : Communications equipment
High Frequency Low Loss Components Telecom PCB Assembly SMT Mounting Services
♦ What's Telecom PCB Assembly?
Telecom PCB Assembly refers to the manufacturing and assembly of printed circuit boards (PCBs) specifically designed for telecommunications equipment, such as:
These PCBs require high-frequency performance, signal integrity, and reliability to handle fast data transmission, low latency, and harsh operational environments.
1. High-Frequency Materials
2. Multilayer & HDI (High-Density Interconnect) Designs
3. RF & Microwave Components
4. Thermal Management
5. Strict Compliance Standards
Components: Select high-frequency low-loss materials (such as PTFE substrates), high-temperature resistant chips (-40℃~125℃), and RF components require 50Ω impedance matching.
Manufacturing accuracy: patch accuracy ±0.025mm (normal ±0.05mm), support 01005 tiny components; laser drilling + micro-hole electroplating to achieve high-density wiring.
Special processes:
Impedance control: line/medium optimization, differential line impedance deviation within ±10%.
Electromagnetic shielding: metal cover/conductive glue isolates radio frequency interference.
Thermal management: heat sink/aluminum substrate conducts heat quickly to prevent chip overheating.
♦ Technical Parameters
PCB Assembly Capability | |||||
Item |
Normal |
Special | |||
SMT Assembly |
PCB(used for SMT) specification | Length and Width( L* W) | Minimum | L≥3mm, W≥3mm | L<2mm |
Maximum | L≤800mm, W≤460mm | L > 1200mm, W>500mm | |||
Thickness( T) | Thinnest | 0.2mm | T<0.1mm | ||
Thickest | 4 mm | T>4.5mm | |||
SMT components specification | Outline Dimension | Min size | 0201(0.6mm*0.3mm) | 01005(0.3mm*0.2mm) | |
Max size | 200 * 125 | 200 * 125 | |||
component thickness | T≤15mm | 6.5mm<T≤15mm | |||
QFP,SOP,SOJ (multi pins) | Min pin space | 0.4mm | 0.3mm≤Pitch<0.4mm | ||
CSP/ BGA | Min ball space | 0.5mm | 0.3mm≤Pitch<0.5mm | ||
DIP Assembly |
PCB specification |
Length and Width( L* W) | Minimum | L≥50mm, W≥30mm | L<50mm |
Maximum | L≤1200mm, W≤450mm | L≥1200mm, W≥500mm | |||
Thickness( T) | Thinnest | 0.8mm | T<0.8mm | ||
Thickest | 3.5mm | T>2mm |
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High Frequency Telecom PCB Assembly SMT Surface Mount Prototype Board FR-4 Images |